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WhatsApp: +86 18203695377WEBMar 27, 2012 · Guo DM, Kang RK, Jin ZJ (2003) Highproductivity ultraprecise machining technique of silicon wafer with dia. over 300mm. World Manuf Eng Market 20(1):35–40. MATH Google Scholar Pei ZJ, Xin XJ, Liu W (2003) Finite element analysis for grinding of wiresawn silicon wafers: a designed experiment. Int J Mach Tool Manuf 43:7–16
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WhatsApp: +86 18203695377WEBA SAG mill, or semiautogenous grinding mill, is a type of machine used in mining and mineral processing operations. It uses the crushing and grinding action of rocks to reduce materials such as copper ore into smaller pieces for further processing. Unlike traditional mills that rely on steel balls or other media to break down materials, SAG ...
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WhatsApp: +86 18203695377WEBOct 18, 2023 · A grinding machine is a tool or piece of equipment used for removing material from a workpiece via abrasion. They typically employ rotating abrasive wheels to shape, smooth, or finish workpieces through grinding. The machining process uses abrasive particles to remove material from a workpiece's surface.
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